H70 Thermal Paste 2g Coolbox

The H70 Thermal Paste from Coolbox is an electrically non-conductive compound designed to enhance heat transfer between CPUs, memory, graphics chipsets, and cooling solutions. It allows for more efficient cooling performance, ensuring that your components remain at optimal temperatures during operation, which is crucial for overall system reliability and performance.

• Features: This thermal compound has low thermal resistance, providing excellent heat transfer capabilities. It's ideal for use in a variety of hardware applications.

Ensuring that your cooling solutions work effectively and your system performs at its best, this thermal paste is an essential component for any computer build.